JPS6120988B2 - - Google Patents
Info
- Publication number
- JPS6120988B2 JPS6120988B2 JP9460977A JP9460977A JPS6120988B2 JP S6120988 B2 JPS6120988 B2 JP S6120988B2 JP 9460977 A JP9460977 A JP 9460977A JP 9460977 A JP9460977 A JP 9460977A JP S6120988 B2 JPS6120988 B2 JP S6120988B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- solder
- anode
- layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 229910018104 Ni-P Inorganic materials 0.000 claims description 9
- 229910018536 Ni—P Inorganic materials 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910020816 Sn Pb Inorganic materials 0.000 claims description 3
- 229910020922 Sn-Pb Inorganic materials 0.000 claims description 3
- 229910008783 Sn—Pb Inorganic materials 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 238000006467 substitution reaction Methods 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical group [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9460977A JPS5429555A (en) | 1977-08-09 | 1977-08-09 | Heat sink constituent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9460977A JPS5429555A (en) | 1977-08-09 | 1977-08-09 | Heat sink constituent |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5429555A JPS5429555A (en) | 1979-03-05 |
| JPS6120988B2 true JPS6120988B2 (en]) | 1986-05-24 |
Family
ID=14114981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9460977A Granted JPS5429555A (en) | 1977-08-09 | 1977-08-09 | Heat sink constituent |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5429555A (en]) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004076724A1 (ja) * | 2003-02-26 | 2004-09-10 | Toyo Kohan Co., Ltd. | ﾊﾝﾀﾞ性に優れた表面処理Al板、それを用いたﾋｰﾄｼﾝｸ、およびﾊﾝﾀﾞ性に優れた表面処理Al板の製造方法 |
| JP2006110769A (ja) * | 2004-10-12 | 2006-04-27 | Toyo Kohan Co Ltd | ハンダ性に優れた表面処理Ａｌ板、それを用いたヒートシンク、およびハンダ性に優れた表面処理Ａｌ板の製造方法 |
| JP2006206945A (ja) * | 2005-01-27 | 2006-08-10 | Toyo Kohan Co Ltd | 低融点ハンダ性に優れた表面処理Ａｌ板 |
| JP2006219736A (ja) * | 2005-02-14 | 2006-08-24 | Toyo Kohan Co Ltd | 表面処理Ａｌ板 |
| JP2008223147A (ja) * | 2008-06-13 | 2008-09-25 | Toyo Kohan Co Ltd | ハンダ性に優れた表面処理Ａｌ板及びその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012256779A (ja) * | 2011-06-10 | 2012-12-27 | Ryosan Co Ltd | ヒートシンク |
-
1977
- 1977-08-09 JP JP9460977A patent/JPS5429555A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004076724A1 (ja) * | 2003-02-26 | 2004-09-10 | Toyo Kohan Co., Ltd. | ﾊﾝﾀﾞ性に優れた表面処理Al板、それを用いたﾋｰﾄｼﾝｸ、およびﾊﾝﾀﾞ性に優れた表面処理Al板の製造方法 |
| JP2006110769A (ja) * | 2004-10-12 | 2006-04-27 | Toyo Kohan Co Ltd | ハンダ性に優れた表面処理Ａｌ板、それを用いたヒートシンク、およびハンダ性に優れた表面処理Ａｌ板の製造方法 |
| JP2006206945A (ja) * | 2005-01-27 | 2006-08-10 | Toyo Kohan Co Ltd | 低融点ハンダ性に優れた表面処理Ａｌ板 |
| JP2006219736A (ja) * | 2005-02-14 | 2006-08-24 | Toyo Kohan Co Ltd | 表面処理Ａｌ板 |
| JP2008223147A (ja) * | 2008-06-13 | 2008-09-25 | Toyo Kohan Co Ltd | ハンダ性に優れた表面処理Ａｌ板及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5429555A (en) | 1979-03-05 |
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